ICP plasma degummer
• The product process application types include degumming, low-temperature degumming, backing film, decarburization film, plasma cleaning and other processes.
• It is used in Si based processes, compounds (including GaN&GaAs&SiC, etc.), MEMS fields, filters, optical communications, micro displays, optical micro processing, packaging and other fields.
• According to the capacity demand of users, there are two products to choose from: SINO Plasma100 (small capacity)/SINO Plasma1000 (large capacity).
• Different process configuration items can be provided according to the user's application scenarios to meet the user's requirements for glue removal such as uniformity and temperature.
• Remote plasma, low damage degumming.
• Low operating costs.