ICP etcher
SINO Plasma200/2000/6000/7000ICP
• The product process application types include Si&Poly etching, dielectric film etching, metal etching, deep silicon etching, silicon carbide etching, gallium nitride etching, aluminum nitride etching, optical waveguide etching, etc.
• It is used in Si based processes, compounds (including GaN&GaAs&SiC, etc.), MEMS fields, filters, optical communications, micro displays, optical micro processing and other fields.
• Different types of transmission platforms can be flexibly configured according to users' product requirements, which is suitable for different application needs of colleges, research and development lines, pilot lines, and large-scale production lines.
• Different process configuration items can be provided according to the user's application scenarios to adapt to the etching of different film layers and meet the customer's needs.
• Low operating costs.
CCP刻蚀机
SINO Plasma200/2000/6000/7000CCP
• Product application processes include Contact/Via etching, Spacer etching, Passivation etching, Hardmask etching, SAB etching, Etch Back.
• It is used in Si based processes, compounds (including GaN&GaAs&SiC, etc.), MEMS fields, optical communications and other fields.
• Different types of transmission platforms can be flexibly configured according to the product requirements of users, which is suitable for different application requirements of R&D, pilot production lines and large-scale production lines.
• Low operating costs.
