Process application
Etching of aluminum, titanium, molybdenum, tungsten, titanium oxide, titanium nitride, aluminum nitride, etc

---

Wafer size
8 inches and below

---

Applicable substrate material
Silicon, silicon carbide, gallium nitride, gallium arsenide, sapphire, quartz glass

---

Application area
Scientific research, Si based process, compounds (including GaN&GaAs&SiC, etc.), MEMS field, filter, optical communication, micro display and other fields.