Mattson Aspen II series
Time：2020/09/07 09:42:34
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PRODUCT INTRODUCTION Aspen II plasma stripper equipment is designed with inductively coupled plasma (ICP) source and dual wafer reaction chamber. It is equipped with high-precision transmission arm and has simple operation interface. The equipment has the advantages of small space occupation, high productivity efficiency, low cost of consumables (COC) and operating cost (COO). It is the best choice for photoresist removal in the semiconductor front end process and back end process. It is the mainstream plasma stripper equipment of semiconductor 8 inch line, and has a very high market share. APPLICATIONS · 6-8 inch silicon based semiconductor production line · Plasma stripper application of 4-6 inch SiC, GaN and GaAs production lines ADVANTAGES · Dual wafer and dual reaction chambers, high productivity efficiency · High density plasma, high stripping rate · Faraday ion completely shielding, low plasma damage on wafer surface of the device · Low consumption and maintenance cost of reaction chamber process kit · Be applied to various plasma stripper conditions |
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