• The product process application types include: rapid heat treatment, rapid annealing, contact annealing, ion implantation annealing, rapid thermal oxidation, rapid thermal nitriding and other processes.
• It is applied to Si based process, compound (including GaN&GaAs&SiC, etc.) process, MEMS field, optical communication and other fields.
• It can be used in different atmospheres according to user application scenarios, such as inert atmosphere, oxygen, mixed gas and other environments.
• The high working temperature is 1300 ℃, the heating rate is 100 ℃/s, and the temperature control accuracy is ≤± 2 ℃.